Tikalflex TSC Bond is a one-part, paste like neutral cure SPU adhesive, specially designed to glue Teakwood and Panels to ship decks ( CFK,steel, aluminium, wood). It cures when exposed to moisture in the air forming a tough, flexible bubble free seal.
It’s non-corrosive and has excellent adhesion and temperature stability.
|Application temperature||10 ° C to 45° C|
|Dense||1,65 g / ml|
|Curing within 24 h||2 mm|
|Min. Temperatur during transport||- 15 ° C|
|Shelflife when stored at 5°C to 25 °C||18 Month|
|Temperature resistance after cure||30°C bis + 75° C|
|Durometer Hardness, Shore A||65|
|Shear Strength||2,4 N / mm²|
|Ultimate Tensile Strength (max elong)||1,9 N / mm²|
|Max. strain||60 %|