
TSC Bond
Tikalflex TSC Bond is a one-part, paste like neutral cure SPU adhesive, specially designed to glue Teakwood and Panels to ship decks ( CFK,steel, aluminium, wood). It cures when exposed to moisture in the air forming a tough, flexible bubble free seal.
It’s non-corrosive and has excellent adhesion and temperature stability.
Alexander – Refit with TSC Bond
Al Salamah – Refit with TSC Bond
Technical data
Chem. Base | SPU |
Application temperature | 10 ° C to 45° C |
Dense | 1,65 g / ml |
Skintime | 45 min |
Curing within 24 h | 2 mm |
Min. Temperatur during transport | - 15 ° C |
Shelflife when stored at 5°C to 25 °C | 12 Month |
Temperature resistance after cure | - 30°C to + 75° C |
Durometer Hardness, Shore A | 65 |
Shear Strength | 2,4 N / mm² |
Ultimate Tensile Strength (max elong) | 1,9 N / mm² |
Max. strain | 60 % |