TSC Bond

Tikalflex TSC Bond is a one-part, paste like neutral cure SPU adhesive, specially designed to glue Teakwood and Panels to ship decks ( CFK,steel, aluminium, wood). It cures when exposed to moisture in the air forming a tough, flexible bubble free seal.

It’s non-corrosive and has excellent adhesion and temperature stability.

Alexander – Refit with TSC Bond

Al Salamah – Refit with TSC Bond

Technical data

Chem. Base	SPU
Application temperature	10 ° C to 45° C
Dense	1,65 g / ml
Skintime	45 min
Curing within 24 h	2 mm
Min. Temperatur during transport	- 15 ° C
Shelflife when stored at 5°C to 25 °C	12 Month
Temperature resistance after cure	- 30°C to + 75° C
Durometer Hardness, Shore A	65
Shear Strength	2,4 N / mm²
Ultimate Tensile Strength (max elong)	1,9 N / mm²
Max. strain	60 %

Technical data

Chem. Base	SPU
Application temperature	10 ° C to 45° C
Dense	1,65 g / ml
Skintime	45 min
Curing within 24 h	2 mm
Min. Temperatur during transport	- 15 ° C
Shelflife when stored at 5°C to 25 °C	12 Month
Temperature resistance after cure	- 30°C to + 75° C
Durometer Hardness, Shore A	65
Shear Strength	2,4 N / mm²
Ultimate Tensile Strength (max elong)	1,9 N / mm²
Max. strain	60 %

Application

TSC Bond is an area adhesive to bond teak to the deck

Properties

Very long open time, up to 45 min

Very good adherence to teak

Very good adherence to CFK, metal and wood

No primer needed

Available sizes

6 x 1.800 ml
20 x 600 ml

Colours

brown